 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
THERMAL ANALYSIS
Turgeon Engineering provides IC surface thermal analysis. Our capabilities include lateral as well as vertical or both types of heat sinking. Heat generation can be specified over thousands of nodes for accurate results. We have provided this service for a number of companies, which helped the placement of components in such a way that thermal gradients effects were minimized in critical device matching areas. Examples of both 3D and contour plots are provided. Click a thumbnail below to see the larger version.
Copyright 2002-2007 Turgeon Engineering, Inc. Site last updated June 28,
2007 |
||||
